1. 2. 3. material content data sheet sales product name esd206-b1-02els e6327 issued 29. august 2013 ma# MA001119580 package pg-tsslp-2-3 weight* 0.21 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal tin 7440-31-5 0.000 0.17 1669 noble metal gold 7440-57-5 0.001 0.65 6467 inorganic material silicon 7440-21-3 0.010 4.79 5.61 47930 56066 leadframe non noble metal nickel 7440-02-0 0.108 51.69 51.69 516990 516990 wire non noble metal copper 7440-50-8 0.001 0.72 0.72 7170 7170 encapsulation organic material carbon black 1333-86-4 0.000 0.19 1880 plastics epoxy resin - 0.011 5.46 54569 inorganic material silicondioxide 60676-86-0 0.067 31.99 37.64 319896 376345 leadfinish noble metal gold 7440-57-5 0.004 1.76 1.76 17640 17640 plating noble metal palladium 7440-05-3 0.001 0.61 6117 noble metal gold 7440-57-5 0.004 1.97 2.58 19672 25789 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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